Product Overview:Part Number: 860-60G Silicone Heat Transfer Compound: Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
Features:
High thermal conductivityHigh dielectric constantHigh dissipation factor Use with heat sinks or metal chassis Will not dry or harden Contains zincs oxides and polydimenthyl siloxane Meets MIL-DTL-47113D Specifications:
Type: Heat Sink Compound
Fill Volume: 60g
Physical State: Paste
Specific Gravity: 2.4
Odor: Odorless
Solubility: Insoluble
MSDS: Click here
Shipping Class: Non-Restricted
Manufacturer: MG Chemicals
